Applications of Silver-Copper Powder
Low Temperature-Curing Conductive Paste
Silver-copper powder is suitable as an additive for conductive adhesive, which has higher cost performance than silver adhesive and reduces the problem of silver migration. Generally, 30% silver content can achieve good electrical conductivity .
| Powder | Solid Content(%) | Resistivity(mΩ) |
| Pure Silver | 52 | 10 |
| SC-30F(S2) | 60 | 100 |
| SC-30F(S3) | 52 | 15 |
